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Ssl Manuf-roadmap July2011

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Ssl Manuf-roadmap July2011
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    July 2011 SSL Manufacturing Roadmap Page 1    July 2011 SSL Manufacturing Roadmap Page 2 DISCLAIMER This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government, nor any agency thereof, nor any of their employees, nor any of their contractors, subcontractors, or their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring  by the United States Government or any agency, contractor or subcontractor thereof. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof.    July 2011 SSL Manufacturing Roadmap Page 3 ACKNOWLEDGEMENTS The Department of Energy (DOE) would like to acknowledge all of the participants for their valuable input and guidance provided to develop this Manufacturing Roadmap. DOE would like to thank those individuals who participated in the solid-state lighting roundtables of March 2011 in Washington, D.C.: DOE LED and OLED Roundtable Participants Vivek Agrawal Applied Materials, Inc. Rainer Beccard Aixtron Iain Black Philips Lumileds Michael Boroson OLEDWorks LLC Anil Duggal GE Global Research Miguel Friedrich nTact David Gotthold Veeco Instruments Mike Hack Universal Display Corporation Mark Hand Acuity Andrew Hawryluk Ultratech Steve Lester Bridgelux Mike Lu Acuity Brands Lighting Mathew Mathai Plextronics Fred Maxik Lighting Science Group Dave Newman Moser Baer Technologies Dennis O’Shaughnessy PPG Industries Steve Paolini Lunera Florian Pschenitzka Cambrios Technologies Corporation Mike Pugh Intematix Bill Quinn Veeco Instruments, Inc. Robert Rustin DuPont Teijin Films Seva Rostovtsev DuPont Displays Doug Seymour Osram Sylvania Kirit Shah Alcoa Gary S. Silverman Arkema Rich Solarz KLA-Tencor Corporation Yongchi Tian Lightscape Materials, Inc. COMMENTS DOE is interested in feedback or comments on the materials presented in this document. Please write to James Brodrick, Lighting Program Manager: James R. Brodrick, Ph.D. Lighting Program Manager EE-2J U.S. Department of Energy 1000 Independence Avenue SW Washington D.C. 20585-0121    July 2011 SSL Manufacturing Roadmap Page 4 Table of Contents Preface   ............................................................................................................................................. 71.   Introduction   ......................................................................................................................... 81.1   Manufacturing Research Highlights   ....................................................................... 91.2   Key findings and general recommendations for 2011   .......................................... 101.2.1   LED Manufacturing R&D Priorities   ......................................................... 111.2.2   OLED Manufacturing R&D Priorities   ...................................................... 111.3   Overall projections/contributions to cost reduction   .............................................. 121.3.1   LED Lighting   ............................................................................................ 121.3.2   OLED Lighting   ......................................................................................... 142.   LED Package and Luminaire Roadmap   ............................................................................ 182.1   Barriers to Adoption   ............................................................................................. 182.2   Cost and quality drivers for LED lighting   ............................................................ 212.3   LED luminaires   ..................................................................................................... 262.3.1   LED Packages in Luminaires   .................................................................... 262.3.2   Luminaire/Module Manufacturing   ............................................................ 272.3.3   LED Driver Manufacturing   ....................................................................... 292.3.4   Test and Inspection Equipment   ................................................................. 302.3.5   Luminaire Reliability   ................................................................................ 302.4   LED Packages   ....................................................................................................... 312.4.1   Epitaxy Processes   ...................................................................................... 312.4.2   Substrates   .................................................................................................. 342.4.3   Manufacturing Equipment   ......................................................................... 362.4.4   Process Control and Testing   ...................................................................... 372.5   Cost Modeling   ....................................................................................................... 383.   OLED Roadmap   ................................................................................................................ 413.1   Manufacturing strategies   ....................................................................................... 413.1.1   Uncertainties in Panel Architecture   ........................................................... 413.1.2   Production Volume Ramp-Up   ................................................................... 423.2   Cost Reduction Opportunities   ............................................................................... 433.2.1   Material Costs   ........................................................................................... 433.2.2   Materials Utilization and Yield Improvement   .......................................... 443.2.3   Processing Speed    ....................................................................................... 453.2.4   High Brightness   ......................................................................................... 463.2.5   Substrate Size and Equipment Costs   ......................................................... 463.2.6   Panel Costs   ................................................................................................ 473.3   Luminaire Assembly   ............................................................................................. 483.3.1   Sizing issues and brightness   ...................................................................... 493.3.2   Variability/binning   .................................................................................... 493.3.3   Light Shaping   ............................................................................................ 503.3.4   Electrical circuits   ....................................................................................... 503.3.5   Reliability Issues   ....................................................................................... 503.3.6   Physical Protection   .................................................................................... 513.3.7   Product differentiation and market expansion   .......................................... 513.4   Substrates and Encapsulation   ................................................................................ 513.4.1   Substrate and Encapsulation Material Selection   ....................................... 52

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