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WINSEM2018-19 CSE3001 ELA SJT417 VL2018195002791 Reference Material I Software Design Specification 1

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  Electronic Stamp ProjectSoftware Design SpecificationVersion: 1.2Date Created: 2003.10.24  SignaturesDateRevisionApproved ByList of ContributorsNameInitialsOrganizationE-Mail Nikhil BandodkarNBSeminole Softwarebandodka@cs.fsu.eduJidong LongJLSeminole Software jidolong@cs.fsu.eduChuck WeddleCWSeminole Softwareweddle@cs.fsu.edu Change HistoryRevisionDateDescription 1.02003.10.24Initial Revision1.12003.10.30Second Revision1.22003.11.07Third Revision - ii -  Preface This document presents the Software Design Specification for the Electronic Stamp project by Seminole Software. The major sections of the document address the system decomposition by module, concurrent process, and data entity. The system dependencies are also described.Section 2, Decomposition Description, gives a view of the whole system design including concurrent processes and data entities that are common amongst all system modules. An important discussion of how the E-Stamp modules extend the existing Pooka email client software is included this section. This discussion includes a UML Class Diagram that depicts the entire system.Section 4, Interface Description, goes into detail about the user interface for each module of the E-Stamp software. This is followed by an important discussion of the processes implemented in logic for each module of the system.Section 5, Detailed Design, extends the design discussion found in Section 2 and describes the design for each system module in more detail. A UML Class diagram is included for each moduledesign discussion. This is followed by a description of the data requirements for each module and the design of those data elements. - iii -  Table of Contents 1Introduction......................................................................................................11.1Purpose....................................................................................................11.2Scope.......................................................................................................11.3Definitions and Acronyms.........................................................................11.4References...............................................................................................12Decomposition Description..............................................................................22.1Module Decomposition.............................................................................22.2Concurrent Process Decomposition........................................................22.3Data Decomposition.................................................................................23Dependency Description.................................................................................43.1Inter-module Dependencies.....................................................................43.1.1Independent Modules.......................................................................43.1.2Dependent Modules..........................................................................43.2Inter-process Dependencies....................................................................43.3Data Dependencies..................................................................................44Interface Description........................................................................................64.1Module Interface.......................................................................................64.1.1E-Stamp Configuration Module Description.....................................64.1.2E-Stamp Vendor Module Description................................................74.1.3E-Stamp Manager Module Description.............................................84.1.4E-Stamp Sending E-Mail Module Description................................104.1.5E-Stamp Receiving E-Mail Module Description..............................104.2Process Interface....................................................................................114.2.1E-Stamp Configuration Process Description...................................114.2.2E-Stamp Vendor Process Description.............................................114.2.3E-Stamp Authentication Process Description.................................114.2.4E-Stamp Manager Process Description..........................................124.2.5E-Stamp Sending E-Mail Process Description...............................124.2.6E-Stamp Receiving E-Mail Process Description.............................125Detailed Design.............................................................................................145.1Module Detailed Design.........................................................................145.1.1E-Stamp Provider............................................................................145.1.2E-Stamp Configuration Module Detailed Design............................155.1.3E-Stamp Vendor Module Detailed Design......................................155.1.4E-Stamp Authentication Module Detailed Design...........................165.1.5E-Stamp Manager Module Detailed Design...................................175.1.6E-Stamp Sending E-Mail Module Detailed Design.........................185.1.7E-Stamp Receiving E-Mail Module Detailed Design......................19 Appendix A – EStamp Class Diagram..................................................................20 - iv -
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