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FABRICATION OF CMOS

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FABRICATION OF CMOS
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  FABRICATION OF CMOS By: JIGYASHA MARUAsst. ProfessorDr. C. V. Raman ,University  Outline • Overview of CMOS • CMOS Fabrication Process Overview • CMOS Fabrication Process • Problems with Current CMOS Fabrication • Future Changes in CMOS Fabrication  What is CMOS?  CMOS technology uses both nMOSand pMOStransistors. The transistors are arranged in a structure formed by two complementary networks • Pull-up network is complement of pull-down • Parallel -> series, series -> parallel  CMOS Fabrication • CMOS transistors are fabricated on silicon wafer  • Wafers diameters (200-300 mm) • Lithography process similar to printing press • On each step, different materials are deposited, or patterned or etched • Easiest to understand by viewing both top and cross-section of wafer in a simplified manufacturing process  Inverter Cross-section • Typically use p-type substrate for nMOStransistors • Requires to make an n-well for body of pMOStransistors n+p substratep+n well AYGNDV DD n+p+SiO 2 n+ diffusionp+ diffusionpolysiliconmetal1nMOS transistorpMOS transistor 
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